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Elpida Memory said Monday it is ready to mass produce registered DDR-II DIMMs for high-performance server applications. The claim indicates that the company’s 533MHz next-generation DRAMs work stably and may be deployed as soon as there is demand for such products.

Elpida’s 2GB PC2-4300 memory modules with ECC support for servers and probably powerful workstations are the world’s fastest high-density DRAM systems that were originally scheduled for mass production in the Q2 2004, according to plans issued in early November. Elpida produces its 512Mb DDR-II chips using 0.11 micron process technology on 300mm wafers in its Japanese fab. The chips mounted on currently released modules have a CAS latency (CL) of 3-4-5 with a burst length of 4, 8.

One interesting peculiarity of Elpida’s DDR-II memory modules is a new type of chip packaging the Japanese company decided to employ. To create slim 4.8mm memory modules with better thermal characteristics Elpida utilized its sBGA (stacked Ball Grid Array) – a new kind of memory packaging for mainstream DRAM devices.

The 2GB DDR-II registered DIMM is part of Elpida’s comprehensive DDR-II product portfolio that also includes 512Mb and 1GB densities.

Pricing of commercial products is to be announced at a later date. Expect Elpida’s new memory modules to be available right after Intel formally launches its new Xeon processors on Nocona core as well as new platform components code-named Lindenhurst and Tumwater.


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