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Intel and dozens of other companies interested in development and implementation of future memory technologies, such as DDR-II and Fully Buffered-DIMM (FB-DIMM), set up a special on-line community that will work on RAM implementation models.

The Memory Implementers Forum will serve as a central community for member companies to share plans, technical documents, marketing collateral and up-to-date news. A catalog will feature the latest products and technologies from across the industry as well as contact information for each member. Any company that develops memory-related products or systems using memory can join the Memory Implementers Forum at no cost with the completion of a legal agreement.

“The Memory Implementers Forum creates a community for discussion of opportunities and challenges across memory technologies. With the volume ramp of DDR-II-enabled platforms in 2004 and the introduction of FB-DIMM interconnect technology in 2005, the Memory Implementers Forum is expected to provide a tool for successful memory technology transitions,” an official for Intel Corporation said.

The two primary technologies of initial focus in the Forum are DDR-II SDRAM and FB-DIMM. DDR-II represents the next wave in memory with memory vendors planning product introductions to support 2004 platforms.

FB-DIMM is a new memory interconnect technology standard for high-end memory connections. FB-DIMM transitions the memory channel to a serial interface and replaces the DIMM register with a memory buffer. FB-DIMM connections are expected to enable systems to scale the number of memory channels available to a server system. Implementations of FB-DIMM enabled DDR-II memory are expected in future Intel’s code-named Lakeport chipsets.

The companies that have joined the Memory Implementers Forum so far include ATP Electronics, Buffalo Technology, Corsair Memory Corporation, Denali Software, Elpida Memory., Hynix Semiconductor., IDT Corporation, Infineon Corporation, Kingston Technology, Micron Technology, Nanya Technology Corporation, Samsung Corporation and WinTec Industries.


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