Infineon Technologies AG announced a capacity expansion at its
The expansion will begin with an initial equipment move in to start production of advanced DRAM chips on 300mm wafers beginning in early 2005. The $1 billion expansion project will increase Infineon’s flexibility and responsiveness to customer requirements for its memory and logic products.
After completion of the initial expansion, the site will be capable of processing 25 000 wafer starts per month in 300mm technology. With operations scheduled to begin in early 2005, the initial build out also will give Infineon the option to ramp up additional capacity rapidly if and when it is required by market conditions.
“Overall customer demand - both for logic as well as memory chips - is increasing at a strong pace. This initial expansion of capacity at
The Infineon Technologies Richmond plant was founded in 1996 as White Oak Semiconductor, and began manufacturing memory IC products in August 1998. Construction on the 300mm plant expansion began in 2000, but its completion was delayed as a result of economic conditions. The plant produces DRAM chips used in personal computers, computer servers and other advanced electronic devices.
“We are leveraging the existing building shell and synergies gained with the experienced staff at
The 300mm production module will initially produce high performance and high density DRAM chips using 110nm technology, with a fast transition to 90nm devices. Infineon will continue to operate the 200mm module now running at full capacity at the
It remains to be seen how the fab expansion affects Infineon's strategy to outsource its DRAM chips production to Asian makers in exchange for process technology.