News
 

Bookmark and Share

(0) 

Elpida Memory and Hiroshima Elpida Memory today announced that they have started construction on the second 300mm wafer fabrication facility. Hiroshima Elpida’s first 300mm facility will also expand its production capacity. Both activities are part Elpida’s strategy to expand its semiconductor mass production to meet growing customer demand for leading-edge, high-performance DRAM products.

The new 300mm plant will be constructed directly adjacent to the first 300mm facility and is slated to begin mass production during the second half of 2005. Elpida will introduce 85nm processing at the new facility later that year. The construction area is approximately 23 000 square meters with a gross floor space of approximately 91 000 square meters – almost double the size of the existing facility. Elpida plans to expand the production capacity of the new facility in several stages leading up to a maximum capacity of 60 000 wafers per month. The total construction cost is estimated at approximately $4.1 billion to 4.5 billion.

Hiroshima Elpida’s first 300 mm facility is currently engaged in the test and mass production of semiconductor products, and Elpida plans to increase its production capacity from 22 000 wafers per month to 28 000 wafers per month during the second half of 2004.

The facility, which began operation in January 2003, primarily manufactures high-density DRAM products for the server market. However, there are future plans to manufacture 1Gb DDR2 SDRAM products as well as Mobile RAM devices for cellular applications and 0.11 micron Digital Consumer DRAM devices for the rapidly-growing consumer electronics market.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Thursday, August 21, 2014

12:10 pm | AMD to Lower Prices of A-Series APUs for Back-to-School Season. New Prices of AMD A-Series APUs Revealed

Wednesday, August 20, 2014

10:53 am | AMD to Cut Prices on FX-9000, Other FX Processors: New Prices Revealed. AMD to Make FX Chips More Affordable, Discontinue Low-End Models

10:32 am | LG to Introduce World’s First Curved 21:9 Ultra-Wide Display. LG Brings Curved Displays to Gamers, Professionals

9:59 am | AMD Readies FX-8370, FX-8370E Microprocessors. AMD Preps Two New “Mainstream” FX Chips

Monday, August 4, 2014

4:04 pm | HGST Shows-Off World’s Fastest SSD Based on PCM Memory. Phase-Change Memory Power’s World’s Fastest Solid-State Drive