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Hynix Semiconductor, one of the world’s largest makers of memory chips, announced this week memory chips for the yet-to-be-announced DDR2 SDRAM platforms intended for servers, workstations and notebooks.
The newly released 4GB registered DIMM modules for servers and workstations and 2GB SO-DIMM modules for notebooks and small form-factor servers utilize Hynix’s 1Gb DDR2 chips manufactured on the company’s 0.11 micron process technology. Hynix plans to start mass production of both modules to coincide with Intel’s server and notebook DDR2 chipset launches, according to the company’s statement.
Hynix already has high-end DDR2 components in its product portfolio: 2GB registered DDR2 DIMM module and 1GB DDR2 SO-DIMM module both based on the 1Gb memory components.
Intel is expected to release its
Hynix said it plans to focus the company’s resources on higher margin products such as graphics memory and consumer memory devices. The company also plans to expand and diversify its product portfolio including NAND flash memory and pseudo SRAM. Hynix also aims to continue investing heavily into the DRAM business.
