News
 

Bookmark and Share

(1) 

OCZ Technology said Wednesday it had redesigned its so-called PC4000 memory modules to allow lower latency settings providing higher performance and greater overclocking potential. The introduction continues the fight between memory makers for the fastest products at every speed grade.

The new PC4000 Gold Series revision 2.0 memory modules operate at 500MHz with CL2.5 3-3 timings, whereas the previous version of the PC4000 Gold Series functioned at CL2.5 4-4-7 latency settings delivering a bit lower performance. The new modules are made on Ultra Low Noise 2 print circuit boards and feature OCZ’ Extended Voltage Protection technologies. OCZ says the ULN2 PCBs allow flawless functioning at high speeds with reduced timings, while the EVP enables end-users to set the voltage from 2.8V to up to 3.0V without loosing the warranty.

Earlier this year OCZ Technology also reduced latencies of its 550MHz memory modules in order to provide higher performance in typical applications that more rely on timings rather than on frequency of random access memory. Additionally, the company has introduced Enhanced Bandwidth technology, a special way of SPD programming to improve efficiency of collaboration between memory controller and memory modules.

A poll carried out by X-bit labs has shown that about 61% of end-users prefer high-speed modules with aggressive timings, while only 20% clearly favour timings over clock-speed and 19% of respondents would buy memory modules with extreme frequency without paying attention to latency settings.

OCZ said its new PC4000 Gold Series R2 are already shipping in 512MB and 1GB dual-channel kits.

Discussion

Comments currently: 1
Discussion started: 07/28/04 05:28:18 AM
Latest comment: 07/28/04 05:28:18 AM

Add your Comment




Related news

Latest News

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014

Wednesday, July 9, 2014

4:04 pm | Intel Readies New Quark “Dublin Bay” Microprocessors. Intel’s “Dublin Bay” Chips Due in 2015