News
 

Bookmark and Share

(0) 

OCZ Technology, one of the most popular memory brands, said Wednesday it had begun shipping the high-speed DDR2 SDRAM memory modules at 667MHz clock-speed following their announcement earlier this year.

“OCZ has finally produced a PC2-5300 DDR2 module which exceeds the effective performance levels of our DDR1 low latency products. At the same time, the 667MHz module provides nearly 50% greater bandwidth therefore processing more data and optimizing speed,” said Dr. Michael Schuette, Director of Technology Development at OCZ Technology Group.

The new products from OCZ operate at 667MHz with CL4 4-4-12 latencies, which is about typical settings for this kind of products. The new memory products from OCZ are aimed at overclockers and enthusiasts who use the latest platforms, such as Intel’s i925X, i915P or i915G, along with the fresh breed of Intel Pentium 4 processors.

DDR2 SDRAM memory products utilize FBGA memory chips for better stability, thermal efficiency, enhanced scalability and better overclockability. Additionally, DDR2 components themselves have some micro-architectural changes from the original DDR specs, such as, Off-Chip Driver calibration (OCD), On-Die Termination (ODT) as well as larger 4-bit prefetch, additive latency, and enhanced registers.

OCZ Technology’s DDR2 memory products at 667MHz clock-speed are available in 512MB and 1GB memory modules as well as in 1GB or 2GB dual-channel kits. While the modules are only certified to handle 1.8V voltage, the company’s EVP technology allows to increase the voltage up to 2.2V without losing the warranty.

Earlier this month Corsair Memory and Crucial unveiled their memory DDR2 modules at 667MHz.

OCZ is shipping DDR2 SDRAM PC2-5300 products at the moment. The company also plans to introduce DDR2 800MHz modules later this year.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones