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OCZ Technology, a maker of advanced memory modules for hardware enthusiasts, announced Tuesday its new memory modules that feature the company’s new Xtreme Thermal Convection (XTC) cooling system that resembles honeycomb. The manufacturer claims that such design allows more efficient heat dissipation.

“Memory modules that implement conventional, solid heat-spreaders provide sufficient heat dissipation but do not adequately address the build up of heat pockets. Our goal is to get rid of the thermal load as quickly and efficiently as possible. A honeycomb perforation contour promotes the physical escape of hot air from the space in between the individual memory components, thus enhancing the performance and preserving the life of the ICs,” explained Dr. Michael Schuette, vice president of technology development at OCZ Technology.

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Currently XTC (Xtreme Thermal Convection) cooling system consists of four pieces: two honeycomb-like heat-spreaders and two small frames that preserve mechanical stability and serve for decoration purposes. The heat-spreaders which are mounted directly onto the memory chips in a manner that avoids gaps between the heat-spreaders and actual memory chips, which provides more efficient heat conduction and dissipation.

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The honeycomb-like heat-spreader seems to be made of aluminum, which dissipates heat rather quickly. Additionally, OCZ claims that honey-comb like design has higher surface area than conventional solid heat-spreaders, while the perforations allow convection to even more effectively reduce heat. The company did not unveil how much more efficient XTC is compared to typical heat-spreaders. The size of the perforations, height and thickness of the heat-spreader should be very well balanced for efficient performance, it looks like, which means that OCZ has spend some time finding the best configuration.

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The PC3200 and PC3500 Gold Gamer eXtreme Series with CL2 2-2-5 timings and 2.8V voltage will be the first OCZ memory parts to include the new XTC heat-spreader. The Gold GX XTC series will be available in 512MB modules and 1GB (2x512) dual-channel optimized kits, OCZ said.


Comments currently: 4
Discussion started: 10/26/05 02:37:05 PM
Latest comment: 10/27/05 10:31:56 PM


Honeycomb's are traditionally used to keep heat in or block sound travel. We don't care about sound because memory makes no noise and the last thing we want to do is keep heat in.

Why does it keep heat in? - because the air gets trapped in the honey comb and provides a barrier to stop heat escaping.

To loose heat you want to maximise surface area to tranfer all the heat to the air then shift that air away as fast as possible (hence the reason eveyone else uses fins and fans).

Don't see how the honeycomb can be efficient, sounds like bad marketing bull to me (which tbh is all heat spreaders on memory have ever been).
0 0 [Posted by:  | Date: 10/27/05 08:32:32 AM]


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