OCZ Technology, a maker of advanced memory modules for hardware enthusiasts, announced Tuesday its new memory modules that feature the company’s new Xtreme Thermal Convection (XTC) cooling system that resembles honeycomb. The manufacturer claims that such design allows more efficient heat dissipation.

“Memory modules that implement conventional, solid heat-spreaders provide sufficient heat dissipation but do not adequately address the build up of heat pockets. Our goal is to get rid of the thermal load as quickly and efficiently as possible. A honeycomb perforation contour promotes the physical escape of hot air from the space in between the individual memory components, thus enhancing the performance and preserving the life of the ICs,” explained Dr. Michael Schuette, vice president of technology development at OCZ Technology.

Click to enlarge

Currently XTC (Xtreme Thermal Convection) cooling system consists of four pieces: two honeycomb-like heat-spreaders and two small frames that preserve mechanical stability and serve for decoration purposes. The heat-spreaders which are mounted directly onto the memory chips in a manner that avoids gaps between the heat-spreaders and actual memory chips, which provides more efficient heat conduction and dissipation.

Click to enlarge

The honeycomb-like heat-spreader seems to be made of aluminum, which dissipates heat rather quickly. Additionally, OCZ claims that honey-comb like design has higher surface area than conventional solid heat-spreaders, while the perforations allow convection to even more effectively reduce heat. The company did not unveil how much more efficient XTC is compared to typical heat-spreaders. The size of the perforations, height and thickness of the heat-spreader should be very well balanced for efficient performance, it looks like, which means that OCZ has spend some time finding the best configuration.

 
Click to enlarge

The PC3200 and PC3500 Gold Gamer eXtreme Series with CL2 2-2-5 timings and 2.8V voltage will be the first OCZ memory parts to include the new XTC heat-spreader. The Gold GX XTC series will be available in 512MB modules and 1GB (2x512) dual-channel optimized kits, OCZ said.