Even though Rambus’ XDR2 dynamic random access memory (DRAM) provides certain advantages, particularly in the space of bandwidth and efficiency, over its predecessor XDR and competing DDR2 and DDR3 standards, its real adoption by the industry is under question. Only three DRAM makers produce XDR and so far none said it would support XDR2. Taiwanese memory makers, known for their pragmatic business approach, are also reportedly known going to produce XDR.
While representatives for Rambus said in an interview with DigiTimes web-site during Rambus Developer Forum (RDF) in
Rambus was reportedly in talks with DRAM vendors, including Taiwanese, about XDR and XDR2 licensing, though, it naturally declined to name them. However, no player in the Taiwan DRAM industry confirmed holding talks with Rambus, the web-site notes. While Taiwanese manufacturers do not produce the majority of memory on the market, they are very practical and fabricate only memory types which are used, or are going to be used, widely across all markets.
When announced, XDR DRAM was supported by Elpida and Toshiba straight away back in mid-2003 with Samsung Electronics jumping on the bandwagon months after. With XDR2 no memory maker has yet announced its licensing.
While XDR2 is generally the same architecture as the XDR, it features several major enhancements, including micro-threading, adaptive timing, transmit and DRSL signaling. XDR2 memory interface is targeting apps that have tremendous memory bandwidth requirements, such as 3D graphics, advanced video imaging, and network routing and switching applications. XDR2 will work at 8GHz and above, which, in case of 16-bit interface provides 16GB/s bandwidth.
Rambus did not comment for the news-story.