In an effort to simplify handset memory design, the two companies will provide hardware- and software-compatible memory products based on common specifications. As a result, cell phone makers should see shorter development times, lower costs and will be able to transit to new generations of NOR flash memory quickly and cost effectively, according to the companies.

The first Multi-Level Cell (MLC) NOR products based on the common specifications are 512Mb devices independently designed and manufactured on 90nm process technology. These products are now available from the two companies. The common subsystem specifications will also extend to 65nm MLC NOR technology and will focus on single-chip 1Gb MLC NOR products.

The common flash memory subsystem is aimed to lower development costs for handset original equipment manufacturers (OEMs) and enable them to get to market faster with feature-rich phones.

NOR flash is the memory technology of choice for the volume mainstream of the cellular-phone market segment. According to industry research firm iSuppli, 92.8% of the embedded flash memory shipping in handsets is NOR flash memory. Intel and ST provide more than 40% of the NOR flash memory in handsets today.

“Today, Intel and ST deliver NOR flash memory products to the top 10 handset OEMs worldwide,” said Darin Billerbeck, vice president and general manager of Intel’s flash products group. “With our jointly developed memory subsystem for 90nm and 65nm NOR flash products, we will continue to build and expand on this leadership in cell phones.”