News
 

Bookmark and Share

(1) 

OCZ Technology, a leading maker of memory modules for enthusiasts, said Wednesday it had managed to shrink latencies of its high-speed DDR2 memory modules to timings that are normal for DDR memory. Lowered latencies on standard speed memory mean that users will be able to enjoy increased performance without overclocking any component.

“It is much easier to document raw clock speed and its theoretical bandwidth than the performance increase achieved by low access latencies; however, the latter is what really matters for the ultimate gaming and multimedia performance,” said Dr. Michael Schuette, vice president of technology development at OCZ Technology.

OCZ’s PC2-5400 EL DDR2 Platinum Edition XTC memory modules are capable of working at 667MHz with CL3-3-3-15 timings, unbelievably low latency settings for modules at such a high-speed. But the memory modules have to run at 2.1V voltage setting, which exceeds standard voltage for DDR2 chips by 0.3V, a significant difference.

The new modules also feature XTC heat-spreaders, honeycomb-like radiators made of aluminum, which dissipates heat rather quickly. OCZ claims that honey-comb like design has higher surface area than conventional solid heat-spreaders, while the perforations allow convection to even more effectively reduce heat.

The new memory product will be available in 512MB modules and 1GB dual-channel memory kits.

“Memory access latencies are the pivotal factor for system performance. The new PC2-5400 EL DDR2 Platinum Edition XTC fills this void by offering faster access times than even the lowest latency DDR400 modules in the market,” Mr. Schuette added.

Discussion

Comments currently: 1
Discussion started: 04/06/06 09:23:06 PM
Latest comment: 04/06/06 09:23:06 PM

Add your Comment




Related news

Latest News

Monday, July 28, 2014

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones

Monday, July 21, 2014

10:32 pm | PQI Debuts Flash Drive with Lightning and USB Connectors. PQI Offers Easy Way to Boost iPhone or iPad Storage

10:08 pm | Japan Display Begins to Mass Produce IPS-NEO Displays. JDI Begins to Mass Produce Rival for AMOLED Panels

12:56 pm | Microsoft to Fire 18,000 Employees to Boost Efficiency. Microsoft to Perform Massive Job Cut Ever Following Acquisition of Nokia