Bookmark and Share


Samsung Electronics, the world’s largest maker of memory modules, demonstrated at Intel Developer Forum (IDF) its memory modules based on the DDR3 devices. The company confirmed that Intel Corp. would start transition to the next-generation memory in the second half of next year.

Dong-Yang Lee, a senior engineer in Samsung Electronics’ memory group, said during the forum that Samsung is ready to mass produce DDR3 as soon as in the second half of 2006, but Intel would support the new memory type in the second half of 2007. Mr. Lee indicated that DDR3 memory will be able to substitute DDR2 as a mainstream memory type in the Q1 2009.

Samsung’s DDR3 memory module. Photo by HKEPC web-site.

Samsung also demonstrated its PC3-6400 dual in-line memory module (DIMM) based on DDR3 chips that operate at 800MHz. Eventually, according to Samsung, DDR3 memory will be able to scale to 1066MHz, 1333MHz and even 1667MHz. The company said that the DDR3 devices will be manufactured using 70nm process technology, which should ensure their cost-efficiency even compared to DDR2.

In addition to micro-architectural advantages DDR2 memory brings over the original DDR memory, such as, On-Die Termination (ODT) as well as larger 4-bit prefetch, additive latency, and enhanced registers, the DDR3 features self-driver calibration, data synchronization and other innovations in addition to increased.

Memory market research company iSuppli expected DDR3 DRAM products to replace their predecessor DDR2 as the main volume product in 2008. iSuppli forcasts a DDR3 market share of 55% the same year. IDC predicted that the first DDR3 memory will be commercially sold in 2006, whereas in 2009 market share of DDR3 will be 65%.


Comments currently: 11
Discussion started: 04/14/06 10:54:56 PM
Latest comment: 08/25/06 01:16:46 PM

Add your Comment

Related news

Latest News

Monday, July 21, 2014

12:56 pm | Microsoft to Fire 18,000 Employees to Boost Efficiency. Microsoft to Perform Massive Job Cut Ever Following Acquisition of Nokia

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014