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OCZ Technology, a leading supplier of high-performance memory modules, announced late on Wednesday its new memory modules that use heat-spreaders with heat-pipes, an innovative cooling solution that provides high reliability, efficiency required for successful overclocking amid absolute silence.

OCZ’s new Reaper-series memory modules feature the company’s heat-pipe conduit (HPC) heat-spreaders that integrate copper heat-pipes to more efficiently transfer heat to special aluminum fin array located atop memory modules. Similar technologies have been in use for years along with small form-factor systems, passively-cooled graphics cards and other products that require efficient heat transfer and dissipation without using sophisticated and, perhaps, noisy fans.

“Overclocking and efficient cooling do not have to be noisy. The Reaper HPC series integrates silent heat-pipe technology into a premium memory product line to assure perfect thermal management of the latest generation of OCZ high-speed DDR2 modules,” said Dr. Michael Schuette, vice president of technology development at OCZ Technology.

The first Reaper HPC modules are rated to run at 1066MHz with CL5 5-5-15 latency settings with 2.1V voltage. The new PC2-8500 modules from OCZ will be available as 2GB dual-channel kits.

“Any noise-conscious end user relying on silent passive cooling while demanding the highest performance will embrace the quality balance of features and innovative design found in the new Reaper HPC series,” Mr. Schuette added.

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