News
 

Bookmark and Share

(0) 

OCZ Technology, a leading supplier of high-performance memory modules and other gear for computer enthusiasts and gamers, announced new memory modules aimed at those, who want to squeeze maximum out of their systems, but are not yet ready to install liquid-cooling system.

OCZ’s new PC2-9200 Reaper HPC memory modules can operate at 1150MHz with CL5 5-5-5-18 latency settings and 2.3V voltage setting. Previous 1.15GHz memory modules from OCZ Technology featured special heat-spreaders that allowed to connect liquid-cooling system to provide really robust cooling. The new products from OCZ capable of running at 1150MHz feature heat-pipe based cooler called Reaper HPC.

OCZ’s Reaper heat-pipe conduit (HPC) heat-spreaders integrate copper heat-pipes that efficiently transfer heat from memory chips to special aluminum fin array located atop memory modules. Even though the new Reaper memory modules have some advantages over OCZ’s Flex XLC modules that use liquid for efficient heat-transfer or Corsair’s Dominator-series which feature active fans, the fin arrays atop of them may not allow to install four memory modules in certain situations due to their dimensions.

“With ultra-high speed memory comes the need for extreme cooling solutions that can be extremely costly or else rely on smart features borrowed from other cooling areas,” commented Dr. Michael Schuette, vice president of technology development at OCZ Technology. “The Reaper HPC series is the first implementation of heat-pipe technology on memory modules using phase change technology for smart management of the thermal dissipation of one of the world’s fastest memory modules, namely the PC2-9200 Reaper.”

The new PC2-9200 modules from OCZ will be available as 2GB dual-channel kits.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, July 21, 2014

12:56 pm | Microsoft to Fire 18,000 Employees to Boost Efficiency. Microsoft to Perform Massive Job Cut Ever Following Acquisition of Nokia

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014