
News
With new AMD CrossFire Certified Modules
[05/14/2007 04:31 PM]by Ilya Gavrichenkov
AMD enthusiasts and system builders will love the customized look of the new Reaper kits; these modules are cooled with an exclusive AMD special Reaper HPC (Heat Pipe Conduit) heatspreader displaying AMD’s “CrossFire Certified” emblem. These unique DDR2-1066 modules feature the Reaper HPC (Heat Pipe Conduit) heatspreader which is engineered to deliver superior silent heat dissipation over traditional heatspreaders. The Reaper HPC is an innovative cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through a compact aluminum fin array. By strategically guiding performance-robbing heat away from key memory components, the unique Reaper HPC design maximizes passive cooling to improve longevity and stability of the modules.
The first certified Reaper HPC memory product available will be 2GB (2x1024MB) dual channel kits optimized for the latest CrossFire platforms. Rated to run with 5-5-5 timings, these modules offer gamers an additional performance edge over conventional DDR2-1066 memory. The CrossFire Certified Reaper 2GB kit is the supreme solution for gamers seeking the advantages of increased reliability and bandwidth management from their memory. Each OCZ PC2-8500 CrossFire Reaper module is backed by an industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.
Discussion
Latest News
Tuesday, October 7, 2008
5:43 pm | AMD Confident In Ability to Produce x86 Microprocessors Despite Intel’s Doubts. AMD Reassures It Can Outsources Production of All x86 Chips
3:04 pm | Intel Has “Serious Questions” Regarding AMD’s Fab Spin Off. Intel Questions Legitimacy of AMD’s Fab Spin Off
12:34 pm | Less Companies to Supply Nvidia GeForce Graphics Cards . Nvidia Intends to Reduce Number of Add-In-Board Partners
9:13 am | AMD Unveils Asset Smart Strategy: Transfers Fabs to The Foundry Company. AMD Spins Off Manufacturing Facilities into Foundry Company
Monday, October 6, 2008
11:27 pm | Analyst Expects Nvidia to Leave Chipset Business Next Year. Rumours Regarding Nvidia’s Exit from Chipset Business Resurrect
11:25 pm | HTC to Monopolize Market of Google Android Based Phones for a Year. HTC Quietly Monopolizes Market of Google Android Cell Phones
9:26 pm | Nvidia Plans Another Re-Branding of Graphics Cards. Nvidia’s GeForce 9 to Become Nvidia GeForce GT, GTS
7:52 pm | Intel: Core i7 to Be Up to 52% Faster Compared to Core 2 Quad. Intel Predicts Massive Performance Improvements with New Chips
4:55 pm | Kingston to Join the SSD Market. The Company to Sell SSDs by Intel
4:51 pm | Sega Preparing a Portable Gaming Console – Rumor. One More Competitor for Sony
4:48 pm | Elpida Completes Development of 65nm Chip Shrink. Enhances Cost Competitiveness and Manufacturing Flexibility





