OCZ Technology today announced their new DDR3 SDRAM kit – OCZ PC3-12800 Flex XLC. It is another overclocker solution built with Micron Z9 chips, but this time with company’s brand name heat-spreaders that allow connecting water-cooling to it.

The newest PC3-12800 modules feature OCZ’s Flex XLC (Xtreme Liquid Convention) heatsink that delivers heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. This unique “flexible” design gives enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation, allowing the memory to operate at extreme speeds without the high temperatures that inhibit or damage the module’s ICs.

The use of advanced Flex XLC cooling system together with careful chips selection allowed setting the frequency of the new solution as high as to 1600MHz and reducing the timings to aggressive 6-6-6-18 values. The specified memory voltage is set at 2.05V.

The PC3-12800 Flex XLC modules are optimized for the premier DDR3 platforms and will be available in 2GB (2x1024MB) dual channel kits. As part of OCZ’s line-up of premium memory, the Flex series is backed by a Lifetime Warranty.