News
 

Bookmark and Share

(2) 

OCZ Technology, a leading supplier of advanced dynamic random access memory, on Monday unleashed the world’s first 4GB memory kit that can operate at 2.0GHz clock-speed. The product may become popular primarily among gamers seeking for absolutely highest performance with their desktop computers.

OCZ DDR3 PC3-16000 Platinum 2GB memory modules are capable of working at 2.0GHz with CL9 9-9-28 latency settings and 1.9V voltage settings, a combination never available before. The manufacturer primarily positions its latest memory modules for platforms based on Nvidia nForce 790i SLI core-logic sets since they are usually considered to be the best for overclocking.

“It is no myth that higher memory densities make it harder to push higher clock frequencies. OCZ Technology pulled off this seemingly impossible task with the release of the world’s fastest high-density memory solution. The new OCZ DDR3 PC3-16000 Platinum Edition kits combine two 2GB modules for 4GB system density running at 9-9-9 latencies and a record-breaking 2GHz data rate. All of this is achieved at only 1.9V which falls well within the voltage tolerances of any DDR3 memory controller currently on the market,” explained commented Dr. Michael Schuette, vice president of technology development at OCZ Technology.

Even though it is indisputable fact that OCZ’s 4GB memory dual-channel module kit at 2.0GHz offers performance unachievable on competing solutions, pricing of such products is too high for the vast majority of end-users and may exceed $500.

Discussion

Comments currently: 2
Discussion started: 05/06/08 11:28:27 AM
Latest comment: 05/07/08 09:05:39 AM

[1-1]

1. 
the majority of overclockers arent rich. get that through your head OCZ.
0 0 [Posted by:  | Date: 05/06/08 11:28:27 AM]
Reply

[1-1]

Add your Comment




Related news

Latest News

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014

Wednesday, July 9, 2014

4:04 pm | Intel Readies New Quark “Dublin Bay” Microprocessors. Intel’s “Dublin Bay” Chips Due in 2015