News
 

Bookmark and Share

(0) 

Kingston Technology on Wednesday unveiled its new family of memory modules that utilize more advanced heat-spreaders than before. The memory supplier hopes that the new cooling systems will help enthusiasts to overclock HyperX T1 to higher clock-speeds.

For years Kingston has used rather simplistic aluminum heat-spreaders with cramps to spread and take the heat away from memory chips. This still allowed the firm to introduce very high-speed HyperX-branded memory modules and be on par with its rivals, who started to use rather complicated cooling systems years ago. But in order to achieve new performance heights, Kingston still had to create an improved cooling system.

The cooling system utilized on Kingston HyperX T1-series memory modules is much taller compared to the original HyperX heat-spreader, thus, can theoretically take away more heat from memory chips.

“The HyperX T1-series heat-spreaders are made of heavy-duty extruded aluminum with extended fins and HyperX Thermal Xchange (HTX) technology for maximum thermal conditions when users take their systems to the extreme. Any gamer or overclocker who intends to dominate with memory will want to use Kingston’s T1 series, which is a great complement to our existing line of HyperX modules with the lower profile heatsink,” said Dara Sun, product manager at Kingston.

Large memory cooling solutions are not panacea against overheating: firstly, active cooling may still be considerably better; secondly, high heat-spreaders may not fit into certain systems with large microprocessor cooler. Therefore, end-users should take into account dimensions of such memory modules before buying.

Kingston HyperX T1-series DDR3 memory modules at 1800MHz – 2000MHz speed-bins as well as DDR2 memory modules at 800MHz and 1066MHz speed-bins are available now. Prices range from $55 to $435.

Tags: Kingston, HyperX

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones

Monday, July 21, 2014

10:32 pm | PQI Debuts Flash Drive with Lightning and USB Connectors. PQI Offers Easy Way to Boost iPhone or iPad Storage

10:08 pm | Japan Display Begins to Mass Produce IPS-NEO Displays. JDI Begins to Mass Produce Rival for AMOLED Panels

12:56 pm | Microsoft to Fire 18,000 Employees to Boost Efficiency. Microsoft to Perform Massive Job Cut Ever Following Acquisition of Nokia