Kingston Technology on Wednesday unveiled its new family of memory modules that utilize more advanced heat-spreaders than before. The memory supplier hopes that the new cooling systems will help enthusiasts to overclock HyperX T1 to higher clock-speeds.
For years Kingston has used rather simplistic aluminum heat-spreaders with cramps to spread and take the heat away from memory chips. This still allowed the firm to introduce very high-speed HyperX-branded memory modules and be on par with its rivals, who started to use rather complicated cooling systems years ago. But in order to achieve new performance heights, Kingston still had to create an improved cooling system.
The cooling system utilized on Kingston HyperX T1-series memory modules is much taller compared to the original HyperX heat-spreader, thus, can theoretically take away more heat from memory chips.
“The HyperX T1-series heat-spreaders are made of heavy-duty extruded aluminum with extended fins and HyperX Thermal Xchange (HTX) technology for maximum thermal conditions when users take their systems to the extreme. Any gamer or overclocker who intends to dominate with memory will want to use Kingston’s T1 series, which is a great complement to our existing line of HyperX modules with the lower profile heatsink,” said Dara Sun, product manager at Kingston.
Large memory cooling solutions are not panacea against overheating: firstly, active cooling may still be considerably better; secondly, high heat-spreaders may not fit into certain systems with large microprocessor cooler. Therefore, end-users should take into account dimensions of such memory modules before buying.
Kingston HyperX T1-series DDR3 memory modules at 1800MHz – 2000MHz speed-bins as well as DDR2 memory modules at 800MHz and 1066MHz speed-bins are available now. Prices range from $55 to $435.