Kingston Technology, the world's largest producer of memory modules, reportedly plans to build yet another memory module plant in Taiwan. Despite of the economic downturn, the company seems to be confident in its future and plans to make a rather substantial investment during global financial crisis.
In a bid to solicit foreign investment, Economic Minister Yiin Chii-ming visited David Sun, founder of Kingston, in the U.S. headquarters in September to convince the memory module leader to build its plant on the island, reports Taiwan Economic News. Confident of Taiwan`s brisk economy and its unparalleled influence on global sectors of semiconductor and DRAM manufacturing, Sun promised Yiin to site Kingston`s second fabrication plant of memory modules in Hsinchu County, northern Taiwan.
With global headquarters in Fountain Valley, California, Kingston employs more than 4,500 people worldwide. Founded in 1987 with a single product offering, Kingston now offers more than 2000 memory products that support nearly every device that uses memory, from computers, servers and printers to MP3 players, digital cameras and cell phones. In 2007, the company's sales exceeded $4.5 billion and the firm's market share was 27.5%, according to market tracker ISuppli.
Kingston plans to build the fab within the next two years. The company still has to officially commit to the project.

Tags
Kingston Set to Build Another Memory Module Plant - Media Report.
Kingston Plans Expansion Despite Economic Crisis
[11/14/2008 11:21 PM]by Anton Shilov
Discussion
Related news
-
Kingston Redesigns Heat-Spreaders for Enthusiast-Class Memory Modules.
Kingston Launches HyperX T1 Family of Memory Modules -
Kingston Rolls Out Industry’s First 2GHz Memory Modules for Intel Core i7 Platforms.
Kingston Details Triple-Channel Memory Module Kits Lineup -
Patriot Memory Joins the Club of Triple-Channel Memory Module Suppliers.
Patriot Announces Triple-Channel Memory Kits for Core i7 Chips -
Corsair Memory Reveals Triple-Channel Memory Kits for Intel Core i7 Platforms.
Corsair Ready to Meet Intel Core i7 with New Dominator, XMS Memory Modules -
OCZ Technology Unleashes Memory Kits for Intel Core i7 Microprocessors.
OCZ Announces Triple-Channel Memory Kits -
Buffalo Announces DDR3 Memory Modules at 2.4GHz.
Buffalo Plans to Release World’s Fastest Memory Modules -
Elpida Develops DDR3 Memory Chips that Can Function at 2.50GHz.
Elpida Creates 2500MHz DDR3 Memory Chips
Latest News
Thursday, February 9, 2012
3:58 pm | Micron Further Cuts Memory Power Consumption with DDR3Lm Chips. Micron Reveals DDR3Lm DRAM with Low Self-Refresh Power
1:27 pm | Intel “Haswell” to Boost Efficiency of Highly-Threaded Applications. Intel’s Next-Gen “Haswell” Processor to Support Transactional Synchronization
Wednesday, February 8, 2012
11:24 pm | IBM Fab Club to Reveal Details on 20nm, 14nm and Beyond Process Technologies Next Month. Globalfoundries, IBM, Samsung to Unveil Next-Generation Chip Technology in March
10:35 pm | Logitech Announces Touch-Sensing Mouse. Logitech Debuts Touch Mouse M600
9:52 pm | HP: Apple iOS and Google Android Too Insecure for Enterprises. HP Doubts Widespread Adoption of iPad, Android Tablets by Enterprises
8:50 pm | Hitachi Begins to Ship New-Generation SLC SSD for Enterprise Customers. Hitachi Ships Industry's First SSDs Utilizing 25nm SLC NAND Flash
4:52 pm | Nvidia Licenses Set of Technologies to Halt All Legal Disputes with Rambus. Nvidia and Rambus Sign License Agreement: Nvidia Licenses PCI Express, Serial ATA, Other Industry Standards
1:13 pm | Nokia to Cease Manufacturing Operations in Europe. Nokia Moves Production to Asia to Lower Costs



