News
 

Bookmark and Share

(0) 

Rambus, a developer of high-speed interfaces and memory technologies, on Monday announced its Mobile Memory Initiative. This development effort focuses on high-bandwidth, low-power memory technologies targeted at achieving data rates of 4.3GHz at best-in-class power efficiency.

“As consumer expectations grow for more media-rich applications on their mobile devices, new memory solutions will be needed to keep pace with the rapidly increasing bandwidth requirements. With the breakthrough technologies developed through the Mobile Memory Initiative, Rambus enables a broad range of advanced mobile applications that will enrich the lives of consumers worldwide,” said Martin Scott, senior vice president of research and technology development at Rambus.

At 4.30GHz clock-speed, a 32-bit memory device can provide 17.2GB/s peak bandwidth; provided that Rambus wants to make such devices extremely effective in terms of power consumption, the memory technology may find itself inside powerful mobile multimedia-oriented devices, such as portable video game consoles, smartphones and so on.

Rambus has combined its high-bandwidth expertise with power-efficient signaling technology to create key innovations for its Mobile Memory Initiative, such as:

  • Very Low-Swing Differential Signaling - combines the robust signaling qualities of a differential architecture with innovative circuit techniques to greatly reduce active power consumption;
  • FlexClocking™ Architecture - a clock-forwarded and clock-distributed topology, enables high-speed operation and a simplified DRAM interface;
  • Advanced Power State Management - in conjunction with the FlexClocking architecture, provides fast switching times between power-saving modes and delivers optimized power efficiency across a diverse range of usage profiles.

Building on innovations pioneered through the development of the award-winning XDR memory architecture, and through the Low-Power and Terabyte Bandwidth Initiatives, Rambus’ Mobile Memory Initiative also incorporates key innovations such as FlexPhase and Microthreading technology.

Rambus will demonstrate a silicon test vehicle for its Mobile Memory Initiative at DesignCon 2009.

Tags: Rambus

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Friday, May 24, 2013

6:09 pm | Second-Generation Kinect Sensor for Windows Due in 2014 – Microsoft. Microsoft Discloses Additional Details About Kinect 2

4:24 pm | New Technique May Open Up an Era of Atomic-Scale Semiconductor Devices. Atom-Scale Semiconductor Devices May Be Incoming, Thanks to New Researchers

Thursday, May 23, 2013

11:30 pm | Kinect Support Is Not Mandatory for Xbox One Video Games – Microsoft. Microsoft Will Not Require Compulsory Support of Kinect from Xbox One Games

11:20 pm | Thermaltake Publishes List of PSUs Compatible with Intel Cori i “Haswell” Chips. 20 PSUs from Thermaltake Are Compatible with Next-Gen Intel Chips

11:10 pm | European Amazon Stores Start to List Xbox One with €599 Price-Tag. Microsoft Xbox One May Cost €599 in Europe, If First Listings Are Correct

9:28 pm | Apple to Assemble Macs in Texas, Set to Manufacture Parts Across the U.S. Apple’s Plan to Move Production Back to U.S. Gets Shape

9:12 pm | Microsoft Confident in Lack of Quality Issues with Xbox One Hardware. Microsoft Vows Xbox One Will Not Have RROD-Like Issues

8:52 pm | AMD Officially Launches New-Generation APUs for Mobile Applications [UPDATED]. AMD Introduces Kabini, Temash and Richland Accelerated Processing Units

6:51 pm | OCZ Reveals Vertex 450 Solid-State Drives: High-End Performance at Mainstream Prices. OCZ Introduces New SSDs Based on Indilinx Barefoot 3 Controller

3:40 pm | Nvidia Unveils GeForce GTX 780: GK110-Based Consumer Solution for $649. Nvidia’s Cut Down Titan LE Becomes GeForce GTX 780