Bookmark and Share

Tags

32nm 40nm 45nm AMD Apple ASUS ATI ATIC Atom Business Cypress E-Book Evergreen Fermi Flash Geforce Globalfoundries GT300 Intel Microsoft Nforce Nokia Nvidia OCZ Radeon Semiconductor Sony SSD USB Windows

News

JEDEC Solid State Technology Association this week announced the publication of registered outline MO-297 for 1.8” slim solid-state drives.  These types of SSDs have a range of applications in consumer products, including netbooks and laptops.

“MO-297 is the first document to standardize a physical outline for a solid state drive. Adoption of this standard has the potential to deliver significant benefits for the industry by creating a single outline for storage suppliers and systems manufacturers to use and reference,” said Jim Leidy, business development manager for Tyco Electronics and Chairman of the JEDEC Task Group behind the effort.

MO-297 defines the dimensions, layout and connector position for 54mm x 39mm solid state drives with a standard SATA connector. Adopting a standard form factor for these types of solid state drives will enable interoperability throughout the supply chain, benefiting drive manufacturers, product designers and consumers.  Conforming to a single standard will simplify the product design process, shortening time to market and facilitating a reduction in costs.

“Consumers will also have the benefit of vendor choice and ease of replacement, since drives adhering to the standard will be interchangeable,” added Mr. Leidy.

The development of SSD standards involves various JEDEC committees as well as numerous external standards organizations.  The MO-297 registered outline correlates directly with SFF Committee specification SFF-8156, and also references the Serial ATA International Organization’s (SATA-IO) Revision 2.6 Specification for connector dimension and tolerance.

Tags: JEDEC, SSD, Flash

Discussion

Comments currently: 0

You must log in to add comments.

Forgot password? Registration

remember me



Related news

Latest News

Wednesday, November 25, 2009

10:44 pm | Infineon and Nokia to Jointly Develop LTE Transceiver Solutions. Infineon and Nokia Collaborate on 4G/LTE Technology

5:50 pm | U.S. Patent Office Again Rejects Rambus’ Claims Against Nvidia. Nvidia Wins Another Round in Patent Dispute with Rambus

2:36 pm | EA Montreal to Concentrate on High-Def Games, Lower Focus on Wii. Large Video Game Developer to Re-Focus on HD Blockbuster Titles

11:58 am | AMD to Describe 32nm x86-64 Processor at Chip Conference [UPDATED]. AMD to Reveal Power Trimming Technologies of Next-Generation Mobile Chip

Tuesday, November 24, 2009

11:50 pm | Nvidia to Start Shipping Next-Generation Tegra to Developers “Soon”. Nvidia Readies Second-Generation Tegra SoC for Handhelds

10:37 pm | Despite Netbook Popularity, Consumers Still Want Notebooks – IDC. Even in Asia, Consumers Still Prefer Notebooks over Netbooks

4:04 pm | Imagination Intros Processors for “Internet Everywhere” Consumer Electronics. Imagination Presents Connected Processors for CE Devices

3:33 pm | Sub-$99 Blu-Ray Players Black Friday Deals Available, But Not a Lot. Walmart to Sell BD Players for $78 on Black Friday

12:27 pm | Microsoft Sued for Banning Third-Party Xbox Memory Cards. Memory Cards Supplier Sues Microsoft

11:55 am | OCZ to Release External USB 3.0 Solid-State Drive. OCZ USB 3.0 SSD Incoming for Consumer Electronics Show

7:52 am | Nvidia’s CEO Expects Underpowered Mobile Devices to Gain Popularity. PC of the Future – Web-Based Device with 4G Connectivity, Says Chief Exec of Nvidia