News
 

Bookmark and Share

(2) 

Rambus, a leading developer of high-performance interconnects and memory types, on Wednesday announced it had achieved a new level of power efficiency with its latest silicon test vehicle developed through its Mobile Memory Initiative (MMI).

The latest silicon-validated results demonstrate that through the use of MMI innovations, a high-bandwidth mobile memory controller can achieve power efficiency of 2.2mW/Gbps. This is nearly a one third improvement over the initial MMI silicon and significantly better than the estimated 10mW/Gbps of an LPDDR2 400 memory controller.

“The performance demands of next-generation mobile devices are vastly outstripping the pace of battery technology improvements. With the innovations developed through our Mobile Memory Initiative, we can deliver advanced applications and maintain long battery life through our breakthroughs in both bandwidth performance and power efficiency,” said Martin Scott, senior vice president of research and technology development at Rambus.

Launched in February 2009, Rambus’ MMI focuses on achieving high bandwidth at extremely low power to enable advanced applications in next-generation smartphones, netbooks, portable gaming and portable media products. Operating at 4.3GHz, a 32-bit memory system using MMI innovations can deliver over 17GB/s of memory bandwidth from a single mobile DRAM device.

Tags: Rambus

Discussion

Comments currently: 2
Discussion started: 10/22/09 02:39:40 PM
Latest comment: 10/24/09 12:09:13 AM

[1-2]

1. 
I wonder what's the stock value of RMBS Inc.
0 0 [Posted by: East17  | Date: 10/22/09 02:39:40 PM]
Reply

2. 
17.85$ ATM

http://finance.yahoo.com/q?s=RMBS


here you can follow stock prices
0 0 [Posted by: Nameisis  | Date: 10/24/09 12:09:13 AM]
Reply

[1-2]

Add your Comment




Related news

Latest News

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones