News
 

Bookmark and Share

(0) 

Elpida Memory and ProMOS Technologies announced on Friday the signing of a DRAM foundry agreement. This agreement marks the beginning of business cooperation between the two companies and will allow both to benefit: Elpida will gain additional capacities, while ProMOS will get fabrication technologies.

"We are confident that the combination of Elpida's advanced technology and ProMOS's highly-efficient, large-scale DRAM manufacturing capabilities will enable an outstanding supply of high-performance and high-quality DRAM products," said Yukio Sakamoto, president and chief executive officer of Elpida Memory.

Under the terms of the agreement, Elpida will provide advanced DRAM process and product technologies to ProMOS, while ProMOS will provide certain amount of manufacturing capacity at ProMOS’ Taichung 300mm wafer fab to Elpida for the manufacturing of Elpida's advanced 1Gb DDR3 devices. Trial runs will be completed in the first half of 2010, with mass production following in the second half of the same year.

Dr. M. L. Chen, president and chairman of ProMOS Technologies hopes that synergistic partnership built through this agreement will combine strengths from both companies. According to ProMOS, Elpida's 1Gb DDR3 device is among the most cost-competitive product in the industry and will pair well with ProMOS' strength in 300mm manufacturing.

“Through this agreement, ProMOS will be able to rapidly increase its capacity utilization rate at its Taichung 300mm facilities. With the recent turnaround in the DRAM market, ProMOS has embarked on the road to recovery,” said Dr. M. L. Chen.

Tags: Elpida, ProMOS, Business, DRAM

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, August 4, 2014

4:04 pm | HGST Shows-Off World’s Fastest SSD Based on PCM Memory. Phase-Change Memory Power’s World’s Fastest Solid-State Drive

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones