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Toshiba Corp. this week announced the launch of a 64GB embedded NAND flash memory module, the highest capacity yet achieved in the industry. The chip is the flagship device in a new line-up of six embedded NAND flash memory modules that offer full compliance with the latest eMMC standard, and are designed for application in a wide range of digital consumer products, including smartphones, mobile phones, netbooks and digital video cameras.
The new 64GB embedded device combines sixteen 32Gb (4GB) NAND chips fabricated with Toshiba's 32nm process technology, and also integrates a dedicated controller. Toshiba is the first company to succeed in combining sixteen 32Gb NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC/MMCA V4.4 standard for embedded MultiMediaCards supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers.
Toshiba offers a comprehensive line-up of single-package embedded NAND flash memories in densities ranging from 2GB to 64GB. All integrate a controller to manage basic control functions for NAND applications, and are compatible with the latest eMMC standard and its new features, including defining multiple storage areas and enhanced security features.
Samples of the 64GB module are available from today, and mass production will start in the first quarter of 2010.
