Toshiba Corp. has announced the launch of a 128GB embedded NAND flash memory module, the highest capacity yet achieved in the industry. The module is fully compliant with the latest eMMC standard, and is designed for smartphones, tablet PCs and digital video cameras.
The new 128GB embedded device integrates sixteen 64Gb (8GB) NAND chips fabricated with Toshiba's 32nm process technology and a dedicated controller into a small package only 17 x 22 x 1.4mm. Toshiba is the first company to succeed in combining sixteen 64Gb NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.
Toshiba now offers a comprehensive line-up of single-package embedded NAND Flash memories in densities from 2GB to 128GB. They integrate a controller to manage basic control functions for NAND applications, and are compatible with the JEDEC eMMC version 4.4 and its features.
Samples of 128GB modules will be available from September, and mass production will start in the fourth quarter of 2010. Samples of 64GB chips will be available from August.
Demand continues to grow for large density chips that support high resolution video and deliver enhanced storage, particularly in the area of embedded memories with a controller function that minimizes development requirements and eases integration into system designs.