News
 

Bookmark and Share

(0) 

OCZ Technology, a leading maker of memory modules and solid-state drives, has announced the world’s fastest 4GB DDR3 memory modules that can operate at blazing 2133MHz. The new modules will indisputably attract attention of enthusiasts looking for both high memory capacities as well as maximum bandwidth.

Initially OCZ’s 4GB 2.13GHz memory modules will be available as dual-channel 8GB or triple-channel 12GB kits within the company’s Flex Ex lineup of kits that are optimized for liquid cooling, but eventually the company will also release them as Reaper HPC and Platinum modules. The ultra-high-speed 4GB DDR3 Flex EX DIMMs will function at 2.13GHz clock-speed with CL10 10-10-30 latencies and 1.65V voltage.

“Usually high speed and high density don’t go hand in hand, but our newly introduced high density 2133MHz memory solutions are engineered to do exactly that. Designed for more than just raw speed, these new kits deliver an excellent blend of performance, density and reliability for a wide range of applications ranging from rendering video to smoother gameplay on the latest titles,” said Alex Mei, chief marketing officer at the OCZ Technology Group.

Engineered for intensive design and editing applications, these 4GB solutions will enable graphic designers, CAD engineers, and music/video professionals to benefit from increased memory resources. In addition, thanks to very high frequencies, they will also appeal for gamers since modern titles rely on memory bandwidth heavily.

All OCZ 4GB modules operate at a low-voltage specification of 1.65V and are tested and qualified on the latest AMD and Intel platforms to ensure ultimate performance and stability. Each module comes backed by the industry-leading OCZ lifetime warranty and technical support.

Tags: OCZ, DDR3

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, July 21, 2014

12:56 pm | Microsoft to Fire 18,000 Employees to Boost Efficiency. Microsoft to Perform Massive Job Cut Ever Following Acquisition of Nokia

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014