Devices in form-factors akin to traditional memory modules have existed for years, just like various special-purpose memory modules for proprietary systems. As various applications become more complex and expensive, it is important to sustain their repair-ability, low-cost and so on, thus, use standard components from different suppliers. In a bid to make various hybrid modules standard JEDEC plans to form a special subcommittee.
“I am optimistic about the potential benefits of hybrid modules. For example, modules with a DRAM interface that also incorporate the non-volatile characteristics of NAND flash could provide new options for data security in a variety of storage and backup systems in the event of power loss. This new family of modules has the potential to help entire segments of the market ‘go green’ by reducing the need for batteries, and may one day extend to all applications that demand memory," said Chris Socci, chairman of the new hybrid modules subcommittee (JC-45.6).
Hybrid memory modules are comprised of different types of memory technologies and leverage some of the beneficial characteristics of each, operating as a system instead of as individual components.
The hybrid memory modules subcommittee will be chaired by PNY Technologies and Cypress Semiconductor.
“The new hybrid modules activity in JC-45 is part of an ongoing effort within JEDEC to extend memory technologies to meet the industry’s need for innovative solutions that will meet future demands. I am pleased to welcome all interested companies to participate in the development of open industry standards within JEDEC to help enable and grow the market for these types of modules," said John Kelly, the president of JEDEC.
Hybrid modules subcommittee will hold its first meeting in Munich, Germany on February 28, 2011.