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Samsung Electronics, the largest maker of dynamic random access memory (DRAM) in the world, said Thursday that it had begun shipping consumer-class memory modules featuring DDR3 DRAM chips produced using 30nm-class process technology. The new modules are more energy-efficient and potentially have higher overclocking potential.

Samsung’s new DDR3 DRAM modules are available in 2GB and 4GB capacities in very low profile (VLP) unbuffered dual in-line memory module (UDIMM) configurations for desktop PCs, and small outline DIMM (SODIMM) configurations for notebook PCs. The new modules transfer data at up to 1600MHz clock-speed, but it is unclear at what voltages and with what latency settings.

Samsung's DRAM modules. For illustration purposes only.

Samsung usually does not sell its memory modules through distribution channels on its own. There is a number of companies, who acquire such devices and then sell them under their own trademarks. As a result, shortly, overclocking-class modules with speeds of 1866MHz and upwards based on Samsung's 30nm DRAMs may emerge in the retain, provided that the chips can actually handle high clock-speeds.

“Samsung is committed to bringing performance-enhanced computing to consumers, and our 30nm-class process technology offers an outstanding combination of advanced low-power DDR3 technology, with blazing speed up to 1600 megabits per second," said Reid Sullivan, senior vice president of mobile entertainment marketing at Samsung Electronics America.

Tags: Samsung, DRAM, 30nm


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