News
 

Bookmark and Share

(0) 

Toshiba Corp. introduced a family of higher performance 24nm eMMC devices. The new NAND flash chips for embedded applications utilize double data rate interface and therefore provide better random access and sequential performance. Thanks to new 24nm fabrication process, the new chips are also small and thus more affordable compared to competing solutions.

The densities of Toshiba's eMMC NAND flash chips with toggle-mode DDR interface for embedded applications range from 2GB to 128GB and offer full compliance with the JEDEC e-MMC version 4.41 standard.

Integrating up to 128GB NAND and an e-MMC controller in a single package, Toshiba's new family of 24nm e-MMC devices combine up to 16 pieces of 64Gb (8GB) NAND chips fabricated with Toshiba's 24nm process technology. Toshiba was the first company to succeed in combining 16 pieces of 64Gbit die in e-MMC to achieve 128GB of memory by applying advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.

Toshiba's 24nm e-MMC process lowers costs, enables higher densities, boosts performance and allows for smaller packages – all of which are key requirements for space-conscious applications such as smartphones, tablet PC s, electronic book readers, digital video cameras, printers, servers, and POS systems.

“The utilization of our new toggle-mode DDR NAND die at 64Gb density is key to enabling our eMMC to support the higher performance, and smaller, thinner packages that customers desire. For example, our 128GB e-MMC can now be supported in a smaller 14x18 package, which many space conscious applications can support," noted Scott Beekman, senior business development manager, mobile communications memory for Toshiba America Electronic Components.

Samples of 8GB, 16GB, 32GB and 64GB 24nm e-MMC product family are available now, and mass production will begin in Q3, with other densities to follow.

Tags: Toshiba, NAND, Flash, eMMC

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones