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Invensas Corp., a wholly-owned subsidiary of Tessera Technologies, has announced that it will demonstrate the dual-face down (DFD) implementation of its new multi-die face-down (xFD) packaging technology at the Intel Developer's Forum (IDF).

xFD is a novel multi-die, wirebond-based packaging technology that mounts integrated circuits (ICs) upside down and staggers them in a shingle-like configuration, incorporating short wirebonds in a structure similar to that of a window-BGA package. Invensas xFD technology costs less to manufacture than conventional multi-die DRAM packages because it employs a parallel process flow; significantly reduces gold and other material usage; and is manufactured on existing wirebond assembly lines. With its technology approach, xFD:

  • improves capacity and decreases overall component size with a 25% to 35% savings in vertical height over conventional solutions
  • enhances electrical performance with a 50% to 70% improvement in speed-bin yield due to symmetric top and bottom die performance
  • provides a 20^ to 30% heat transfer advantage over conventional dual-die packages (DDPs)


SO-DIMM vs. xFD

As a result of rapid growth in multi-core processing and computing virtualization, today’s data center servers require increased DRAM capacity and performance. New applications for notebook computers, tablets and smartphones also demand additional device performance balanced with battery life and reduced form-factor. A market-ready packaging platform, the Invensas xFD technology is cost-effective and improves capacity and performance for DRAM devices and memory modules.

“We developed the xFD technology platform in response to continued industry demand for denser, faster and cheaper DRAM solutions for servers and mobile devices. xFD provides single-die package performance in a multi-die configuration as well as delivering significant thickness and thermal advantages. Unlike more complex alternatives, xFD is manufactured using existing industry manufacturing capacity, significantly reducing the cost, time and risk of high-volume adoption," said Simon McElrea, president of Invensas Corp.

Tags: DRAM, xFD, Invensas, Tessera

Discussion

Comments currently: 2
Discussion started: 09/08/11 08:32:39 PM
Latest comment: 09/09/11 11:38:21 PM

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1. 
That's nice and all, but consumers demand higher density ram too!
Corporations milk the consumer, and serve them last as usual.
This 4GB ram limit per ram module needs to be broken by more than ADATA (8GB ram sticks).

Motherboard makers, always state that their boards support 32GB of ram, and that pisses off, for there are no 8GB sticks to make that happen on the consumer/non-server end.
0 0 [Posted by: ericore  | Date: 09/08/11 08:32:39 PM]
Reply

2. 
So either DRAM has finally adopted "flip chip" dies, or they're taking the heat savings of new process technologies and reverting back to where the heat bearing surface faces down, along with the interconnects to save cost.

I'm guessing on the latter... If it saves all that expensive "interconnect cost" that had to be developed when cpu's went to exposed dies.

I'm probably totally off, but it's an amusing thought! What's old is new again...
0 0 [Posted by: xrror  | Date: 09/09/11 11:38:21 PM]
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