Samsung Electronics said that it had started producing embedded multi-chip package (eMCP) memory for use in the rapidly expanding market segment for entry- to mid-level smartphones. Samsung’s new eMCP solutions utilize LPDDR2 memory made using 30nm process technology and NAND flash memory produced at 20nm-class node.
Samsung’s embedded MCP solutions are fabricated in packages that consist of a 4GB e-MMC (embedded MultiMediaCard) based on 20nm-class NAND flash memory for data storage, and a choice of 256MB, 512MBs or 768MBs of 30nm-class LPDDR2 DRAM for supporting high-performance mobile device systems. Focusing on the high-end smartphone market, Samsung’s previous eMCPs combined 1GB of 30nm-class LPDDR2 DRAM with 32GBs of eMMC memory using 20nm-class NAND flash.
“As the need is growing for more advanced software and increased data storage in smartphones and tablets, mobile device makers are expected to introduce embedded memory solutions throughout 2012 that offer higher performance and density. Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of eMCP solutions in 2012,” said Myungho Kim, vice president of memory marketing of device solutions at Samsung Electronics.
The 30nm-class LPDDR2 DRAM chip in the new eMCPs performs a key role in enhancing the performance of entry- to mid-level smartphones with a data transmission speed of 1066MHz, which doubles the performance of the industry’s previous mobile DRAM (MDDR).
The new eMCP memory solutions will help entry- to mid-level smartphones deliver enhanced performance and longer battery life, while providing mobile handset developers with a simpler design process.