Mosaid Technologies said this week that it had initiated sampling the industry’s first NAND flash MCP (multi-chip package) with a 16-die NAND stack operating on a single high-performance channel.
“The 16-die stack 512Gb HLNAND MCP demonstrates the superior scalability of HLNAND’s ring architecture compared to the parallel bus architecture used in industry standard NAND Flash products. HLNAND’s ring architecture allows a virtually unlimited number of NAND die to be connected on a single channel without performance degradation,” said Jin-Ki Kim, Vice president of research and development at Mosaid.
Mosaid’s 512Gb HLNAND (HyperLink NAND) MCP combines a stack of 16 industry standard 32Gb NAND flash die with two HLNAND interface devices to achieve 333MB/s output over a single byte-wide HLNAND interface channel at 1.8V with no power termination resistors needed. Conventional NAND flash MCP designs cannot stack more than four NAND dies without suffering from performance degradation, and would require two or more channels to deliver similar throughput.
“HLNAND confers distinct performance and form factor advantages. Using HLNAND technology, system engineers can design Gigabyte per second bandwidth and Terabyte capacity solid state drives (SSDs) with a single controller chip. Competing designs utilizing industry standard NAND MCPs will require multiple controller chips,” said Peter Gillingham, vice president and chief technology officer at Mosaid.