News
 

Bookmark and Share

(0) 

Micron Technology has announced an industry first with high-volume availability of its 45nm phase change memory (PCM) for mobile devices, featuring 1Gb PCM plus 512Mb LPDDR2 in a multi-chip package.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards. Micron's 45nm PCM solution is currently targeted for utilization in feature phones, with a future roadmap aimed at addressing smartphones and media tablets.

Micron's PCM product line has established a foothold in the wireless industry, as evidenced by longstanding key relationships with global customers and enablers, ongoing engagement with major device manufactures, and strong cooperation with Intel mobile communications, which includes recent PCM qualification.

"Intel's mobile and communications group is at the forefront of new cellular product and technology enablement, and we see great value in Micron's PCM technology. With a commitment to innovation and standardization, as well as a long history of cooperation with Intel, Micron is a trusted supplier," said Stefan Butz, vice president of marketing and product planning for Intel's mobile and communications group.

As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

Tags: Micron, PCM, LPDDR2, Intel

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones