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Cadence Design Systems on Monday announced that the first products in the Cadence DDR4 SDRAM PHY and memory controller design intellectual property (IP) family have been proven in silicon on TSMC's 28nm (28HPM and 28HP) process technologies.

"We are excited to be the first to offer silicon-proven DDR4 memory controller and PHY IP that will enable our customers to exceed performance and power requirements in their next generation SoCs with reduced risk," said Marc Greenberg, director of product marketing, SoC realization group at Cadence.

Cadence has received and characterized multiple versions of its DDR PHY and controller IP in 28nm silicon based on advanced drafts of the DDR4 standard. The proposed DDR4 standard, anticipated to be released by JEDEC later this year, will offer users substantial performance benefits over DDR3. DRAM devices adopting the DDR4 standard are expected to have 50% higher operational frequency and double the memory capacity of DDR3 devices while reducing the power consumed in the DRAM by as much as 40% per bit transferred.

"DDR4 is going to be the next big thing in DRAMs, but its signaling is challenging to handle. As PCs migrate to DDR4 DRAMs, this standard will become the volume leader, giving it a price advantage that will be impossible to ignore. ASIC designers who want to take advantage of that pricing are likely to need a lot of help putting a reliable interface on their products," said Jim Handy of Objective Analysis.

The Cadence silicon-proven PHY family includes a high-speed implementation of the DDR4 PHY that exceeds the data rates specified in the DDR-2400 draft, meeting the requirements of next-generation computing, networking, cloud infrastructure, and home entertainment devices, while offering interoperability with current DDR3 and DDR3L standards. Also proven in TSMC 28HPM silicon, is a low-power, all-digital mobile PHY implementation that exceeds the data rates called for in both the DDR-1600 and DDR-1866 DDR3 standards and the maximum data rate of the low-power LPDDR2 standard. As a result, SoC designers can now deploy fast, power-efficient memory technologies in next generation mobile designs with confidence.

Tags: Cadence, DDR4, DRAM, 28nm, TSMC

Discussion

Comments currently: 6
Discussion started: 09/10/12 05:44:41 PM
Latest comment: 09/11/12 11:05:57 AM
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1. 
For devices that are actually bottle-necked by current DDR3 RAM this will be useful. That doesn't include desktop PCs per se but it may help other devices.
1 0 [Posted by: beenthere  | Date: 09/10/12 05:44:41 PM]
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2. 
About time to move to faster RAM.
1 0 [Posted by: nitro912gr  | Date: 09/11/12 04:35:36 AM]
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3. 
What does "...while offering interoperability with current DDR3 and DDR3L standards" mean? I don't suppose they are backward compatible with DD3 interface - pin + voltage, etc.
0 0 [Posted by: gamoniac  | Date: 09/11/12 05:59:26 AM]
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if it is... then that maybe better news than I though.
If you can add the new chips in the ddr3 dimms, you can possible add a ddr4 memory controler in PCIe x1 and upgrade the whole system without the need to change motherboard!
0 1 [Posted by: nitro912gr  | Date: 09/11/12 06:44:06 AM]
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4. 
So are we talking a year to come to market?
0 1 [Posted by: KeyBoardG  | Date: 09/11/12 09:20:31 AM]
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