News
 

Bookmark and Share

(0) 

Samsung Electronics said this week that its new 64Gb eMMC NAND flash memory storage chip for smartphones and tablets memory went into production late last month using 10nm-class process technology.

Samsung is applying eight 64Gb high-performance NAND memory layers produced using its 10nm-class technology to the new 64GB eMMC Pro class 2000 memory solution. The new embedded memory solution exceeds the performance levels of the conventional 64GB eMMC Pro class 1500 based on an eMMC 4.5 interface by 30%. The 64GB eMMC Pro class 2000 measures 11.5mm by 13mm, which represents a 20% reduction in size over the conventional embedded memory form factor (12mm by 16mm).

The new eMMC 64GB Pro 2000 memory solution has a random write speed of 2000 IOPS (input/output per second) and a random read speed of 5000 IOPS. In addition, sequential read and write speeds are 260MB/s and 50MB/s respectively, which is up to 10 times faster than a class 10 external memory card that reads at 24MB/s and writes at 12MB/s, greatly enhancing the smoothness of multitasking on mobile gadgets.

“The new high-speed, small form factor eMMC reinforces Samsung’s technology leadership in storage memory solutions. We look forward to expanding our line-up of embedded memory solutions in conjunction with the new chip’s design, in pursuing a system-level adoption of application processors and other key components that form the foundation for the most advanced mobile platforms. This will allow us to better attend to time-to-market demands enabling the design of more convenient features for next-generation mobile applications,” said Myungho Kim, vice president of memory marketing at device solutions division of Samsung Electronics.

Tags: Samsung, eMMC, NAND, Flash, MLC, 20nm

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones