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Micron Technology on Thursday introduced the industry's smallest 128Gb NAND flash memory device made using 20nm process technology. The new 128Gb device stores three bits of information per cell (3bpc or triple level cell [TLC]), which makes it smaller and more cost-efficient. 

Measuring 146mm2, the new 128Gb TLC device is more than 25% smaller than the same capacity of Micron's 20nm multi-level-cell (MLC) NAND device. The 128Gb TLC device is targeted at the cost-competitive removable storage market (flash cards and USB drives), which is projected to consume 35% of total NAND gigabytes in calendar 2013.1 Micron is now sampling the 128Gb TLC NAND device with select customers; it will be in production in calendar Q2.

"This is the industry's smallest, highest-capacity NAND flash memory device – empowering a new class of consumer storage applications. Every day we learn of new and innovative use cases for flash storage, underpinning the excitement and opportunity for Micron. We are committed to enriching our portfolio of leading Flash storage solutions that serve our broad customer base," said Glen Hawk, vice president of Micron's NAND solutions group.

Tags: Micron, TLC, NAND, Flash, 20nm, 128Gb

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