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Samsung Electronics, the world’s largest maker of NAND flash memory, announced on Wednesday that it began mass producing a 128Gb, 3-bit-per-cell (3bpc or triple level cell/TLC) NAND memory chips using 10nm-class process technology earlier this month. The highly advanced chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs). Previously TLC NAND was mainly used for memory cards.

Samsung’s 128Gb NAND flash is based on a 3-bit multi-level-cell design and 10nm-class process technology. It boasts the industry’s highest density as well as the highest performance level of 400Mb/s data transfer rate based on the toggle DDR 2.0 interface. 10nm-class means a process technology node somewhere between 10nm and 20nm.

Utilizing 128Gb NAND flash memory, Samsung will expand its supply of 128GB memory cards. Samsung now will also increase its production volume of SSDs with densities over 500GBs for wider adoption of SSDs in computer systems, while leading the transition of main storage drives in the notebook market from hard disk drives (HDDs) to SSDs.

Demand for high-performance TLC NAND flash and 128Gb high storage capacities has been rapidly increasing, driving the adoption of SSDs with more than 250GB data storage, led by the Samsung SSD 840-series.

Samsung started production of 10nm-class 64Gb MLC NAND flash memory in November last year, and in less than five months, has added the new 128Gb NAND flash to its wide range of high-density memory storage offerings. The new 128Gb chip also extends Samsung’s TLC NAND memory line-up along with the 20nm-class 64Gb TLC NAND flash chip that Samsung introduced in 2010. Further, the new 128Gb TLC NAND chip offers more than twice the productivity of a 20nm-class 64Gb MLC NAND chip.

“By introducing next-generation memory storage products like the 128Gb NAND chip, Samsung is extremely well situated to meet growing global customer needs. The new chip is a critical product in the evolution of NAND flash, one whose timely production will enable us to increase our competitiveness in the high density memory storage market,” said Young-Hyun Jun, executive vice president of memory sales & marketing at device solutions division at Samsung Electronics.

Samsung plans to keep introducing leading-edge SSDs and embedded memory storage solutions with high-quality features, in accelerating the growth of the premium memory market.

Tags: Samsung, 3bpc, TLC, MLC, NAND, Flash, SSD, 10nm

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