by Anton Shilov
11/06/2007 | 10:09 PM
OCZ Technology, a leading manufacturer of high-performance memory modules and other components for computer enthusiasts, on Tuesday unveiled its new memory modules that feature the company’s new Reaper cooling systems. The new coolers will help the supplier of memory modules to offer higher-performance products eventually as with better heat dissipation memory overclocking becomes easier.
<%BANNER[article]%>The new OCZ ReaperX HPC (heat-pipe conduit) cooling system for memory modules can offload heat using high-performance copper heat-pipes directly from memory chips and transfer it to the aluminum fin array, which quickly dissipates heat. Even though the design is quite logical, it has never been used previously. Earlier heat-pipes of Reaper memory modules were installed in a way to transfer heat from heat-spreaders, not from memory chips.
The innovative ReaperX HPC cooling mechanisms for memory modules will eventually help OCZ to offer higher-performance products due to better thermals and increased stability in overclocked mode.
In addition to the new cooling system for memory modules OCZ Technology introduced OCZ PC2-6400 ReaperX HPC Enhanced Bandwidth 4GB dual-channel memory kit that boasts with 800MHz operating speed and CL4 4-3-15 latency settings, a rather rare combination. The modules require 2.1V voltage supply.
“The new ReaperX series once again raises the memory bar for desktop computers by combining a high-density configuration with Enhanced Bandwidth technology and an innovative heat pipe design heat spreader. The result is the new OCZ ReaperX, representing the ongoing commitment at OCZ Technology to promote ultra low latency, high frequency modules featuring standard and EPP operation modes as part of our leading role in the industry,” commented Dr. Michael Schuette, vice president of technology development at OCZ Technology.