by Anton Shilov
06/08/2010 | 09:01 PM
Kingmax, a rather well known supplier of high-performance memory modules, has unveiled what it calls invisible heat-spreaders. Instead of using traditional radiators to take away heat from memory chips on modules, Kingmax proposes to cover the chips and modules with a special compound that, as the company claims, reduces heat of memory chips. Initially Nano Thermal Dissipation Technology will be used on Kingmax’s 2.40GHz dual-channel DDR3 kit.
The Nano Thermal Dissipation Technology (NTDT) adopts the nano-size silicone (in fact, the original press release stated that the compound consists of silicon – X-bit) compound that fills up the invisible vacant space of the smooth surface to remove the surface heat more quickly. Kingmax compares its NTDT compound with a sponge that pulls the heat from memory chips operating at rather high 2.40GHz clock-speed and releases it into the air at a faster rate than a normal product would do itself. Kingmax also states that the silicone compound could be mixed into the resin for product packaging; it would bring a better thermal dissipation result than just covering the surface of chips.
The manufacturer does not reveal any details about its compound. Although there are substances that may speed up spreading of heat, they are hardly efficient. According to Kingmax’s own measurements, DRAM modules featuring NTDT have 2°C lower temperature compared to non-NTDT modules. The company does not describe the procedure of measuring temperature and conditions of the measurements.
Considering the fact that efficiency of Kingmax’s nano thermal dissipation technology seems to be uncertain, it looks like the “invisible” heat-spreader is nothing more than the practical lack of heat-spreaders, which is presented as a huge bonus since the modules get smaller.
Even though the prospects of NTDT are more than questionable, Kingmax’s latest 4GB DDR3 dual-channel memory kit sports rather impressive specifications: 2400MHz clock-speed with CL10 at 1.5V – 1.8V voltage setting. It remains to be seen whether the world’s first and only 2.40GHz memory module set that does not have a traditional heat-spreader will work stably and reliably.