by Anton Shilov
11/23/2010 | 11:29 PM
OCZ Technology Group on Tuesday unveiled two new types of its own-designed heat-spreaders for memory modules as well as expanded its product families with new offerings. The new cooling solutions are not as compact as OCZ's own extreme thermal convection (XTC) heat-spreaders, but are smaller than some of competing solutions.
The new extreme thermal exchange (XTE) cooling solution is a rather simple solid heat-spreaders with increased height to increase the heat dissipation surface area. The cooling devices are made of aluminum alloy. The Blade 2-branded heat-spreaders feature finned anodized aluminum heatsink design and some shapes on the surface are stylized for blades.
“Building on our previous lines of enthusiast overclocking memory, the new XTE and Blade 2 DDR3 memory series are designed to set the benchmark once again and deliver the ultimate in performance and stability. Featuring new compact, yet highly efficient heatspreader designs, these hand-tested kits are the ideal solution for overclockers gaming and productivity applications, and are optimized for the latest generation of platforms from Intel and AMD," said Alex Mei, chief marketing officer of OCZ Technology Group.
OCZ Blade 2-series memory modules are available in triple-channel (6GB, PC3-19200/2400MHz CL9 and CL10, PC3-17000/2133MHz CL7 and CL8) and dual-channel DDR3 kits (4GB, PC3-19200/2400MHz CL9 and CL10, PC3-17000/2133MHz CL7 and CL8) with 1.65V voltage. Other new additions include the Platinum XTE and Gold XTE series that offer dual-channel and triple-channel memory kits capable of operating at 2133MHz, 2000MHz or 1600MHz clock-speeds with CL6, CL7, CL8 or CL9 latencies.
OCZ’s latest 6GB and 4GB memory kits are specifically designed and qualified on a range of motherboards supporting enhanced clock speeds beyond typical JEDEC profiles. OCZ modules are backed by the OCZ lifetime warranty.