Samsung Shows Off Industry's First LPDDR3 Memory

Samsung Develops World's First 4Gb LPDDR3 Chip

by Anton Shilov
09/29/2011 | 12:24 PM

Samsung Electronics, the largest maker of dynamic random access memory (DRAM), said on Thursday that it had completed development of the industry’s first monolithic 4Gb LPDDR3 memory for mobile applications like smartphones and tablet PCs. The new type of memory will power the next-generation of high-end ultra-portable devices.


The new 4Gb LPDDR3 DRAM can transfer data at up to 1600MHz clock-speed, which is approximately 50% faster than the industry’s current highest performance LPDDR2, which operates at 1066MHz. The new component also consumes 20% less electrical power than its predecessor. In addition, by stacking two 4Gb chips, Samsung is enabling use of a single 1GB LPDDR3 package, with a data transmission rate up to 12.8GB/s . The LPDDR3 chips are made using 30nm-class process technology.

"Samsung is offering the most advanced green mobile memory solution by developing the industry’s first 30nm-class 4Gb-based LPDDR3 packages. Samsung will keep working closely with mobile device designers to deliver high-performance mobile solutions, while expanding the next-generation mobile memory market," said Wanhoon Hong, executive vice president, memory sales and marketing of device solutions at Samsung Electronics.

Starting next quarter, Samsung will begin sampling the 4Gb LPDDR3 chips to key mobile device providers. The chips are expected to be widely adopted next year in advanced mobile applications including next-generation smartphones and tablet PCs.

To accommodate the growing need for higher density mobile memory solutions to process large amount of data, the maximum amount of mobile DRAM in high-end mobile devices will grow from 1GB (8Gb) up to 2GB (16Gb) by early next year. These densities will be available by stacking four 4Gb LPDDR3 chips.

According to a research report from IHS iSuppli, the market for LPDDR3 DRAM will expand sharply starting in 2013. Samsung will be readying the market by mass producing more components in 2012 therein encouraging faster adoption of premium mobile DRAM solutions throughout the mobile electronics industry.