by Anton Shilov
07/02/2012 | 10:10 PM
Samsung Electronics has announced that it had begun sampling the industry’s first 16GB registered dual inline memory modules (RDIMMs), designed for use in enterprise server systems. The world's largest maker of dynamic random access memory (DRAM) plans to start making DDR4 modules for servers next year.
Samsung currently samples 8GB and 16GB DDR4 memory modules that are based on chips made using 30nm-class process technology and which operate at 1.2V voltage. While Samsung does not directly states clock-speed of memory modules, the company notes that by next year the DDR4 will reach twice the current 1600Mb/s of DDR3 memory, which points to 3.20GHz effective clock-speed.
Samsung sampled new 8GB and 16GB DDR4 modules in June, in addition to providing them to major CPU and controller makers. The modules will bring the highest density and performance levels to premium enterprise server systems. Samsung previously introduced the industry’s first 30nm-class 2GB DDR4 module in December, 2010.
Samsung will keep working on completion of the JEDEC (Joint Electron Device Engineering Council) standardization of DDR4 technologies and product specifications, which is expected to be accomplished by August.
“By launching these new high-density DDR4 modules, Samsung is embracing closer technical cooperation with key CPU and server companies for development of next-generation green IT systems. Samsung will also aggressively move to establish the premium memory market for advanced applications including enterprise server systems and maintain the competitive edge for Samsung Green Memory products, while working on providing 20nm-class based DDR4 DRAM in the future,” said Wanhoon Hong, executive vice president, memory sales and marketing at Samsung Electronics.
The company said it will work closely with its customers including server OEMs, as well as CPU and controller makers, to expand the market base for high-density DDR4 modules, of which it plans to begin volume production next year. It also is set to expand the overall premium memory market with its most advanced 20nm-class based DDR4 DRAM products, which will be available sometime next year at densities up to 32GB.