Micron and TE Connectivity Unveils Memory Modules for Ultrabooks

Micron Reveals Single-Sided DDR3 Modules

by Anton Shilov
02/07/2013 | 10:44 PM

Micron Technology, a renowned maker of computer memory, and TE Connectivity (TE), a leading manufacturer of connectivity solutions, this week introduced single-sided SODIMM and a low-profile single-sided DDR3 SODIMM connector designed for ultra-thin notebooks, ultrabooks, convertibles, tablets and other thin and light devices.

 

"Given the depth and breadth of ultrathin devices currently on the market, coupled with consumer demands for sleek, lightweight designs, Micron's objective is to offer solutions that meet the specialized power, portability and battery life needs. Micron's unique single-sided SODIMM form factor meets those requirements and leads the way for future developments in this growing segment," said Kris Kido, Micron's director of business development, computing devices.

The new single-sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35% savings compared to 4.6mm for a standard SODIMM solution. At present ultra-thin laptops come with DRAM soldered directly to mainboards, which greatly reduces flexibility and eliminates any upgrade paths for the end-user.


Micron single-sided DDR3 DIMM

Micron standard DDR3 DIMM

Micron's single-sided SODIMM is available in a 4GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.

TE engineers designed the new single-sided DDR3 SODIMM connector to deliver peak performance with high-speed data applications. The connector features a 35% reduction in height, compared with similar low-profile connectors, which in turn, reduces the height of the end-product by 5% to 10%. It also reduces motherboard shadow area by nearly 156 mm2, or 312 mm2 for common dual-socket implementation. The DDR3 SODIMM connector accepts modules that meet JEDEC MO268 industry standards and is offered in both standard and reverse types.

"In the past, the miniaturization of circuitry-powering device memory often compromised reliability. Our DDR3 SODIMM connector solves that problem, ensuring durable connectivity to optimize device functionality, speed and usability. Micron Technology shares our commitment to provide consumers with high-quality, reliable cost-effective solutions to maximize product performance," said Hook Chang, product manager at TE consumer devices.

Single-Sided SODIMM samples are available from Micron now, with mass production scheduled for Spring, 2013. Single-Sided SODIMM connector samples are available from TE Connectivity now, with mass production scheduled for June, 2013.