by Anton Shilov
07/23/2013 | 07:15 PM
Samsung Electronics, the No. 1 maker of dynamic random access memory, on Tuesday announced the industry’s first mass production of 3GB LPDDR3 mobile DRAM, the highest density mobile memory solution for next-generation smartphones, which will bring a generation shift to the market from the 2GB packages that are widely used in current mobile devices.
The Samsung 3GB LPDDR3 mobile DRAM uses six of the industry’s smallest 20nm 4Gb LPDDR3 chips operating at 2133Mb/s, in a symmetrical structure of two sets of three chips stacked in a single package only 0.8mm high. Samsung’s 3GB LPDDR3 DRAM connects with a mobile application processor using two symmetrical data transfer channels, each connected to a 1.5GB storage part. Though asymmetric data flow can cause sharp performance dips at certain settings, the symmetrical structure avoids such issues, while maximizing system level performance.
“Three gigabyte mobile DRAM will be adopted in the most up-to-date, high-end smartphones starting in the second half of this year − an initial adoption that will expand to most high-end smartphones worldwide next year. We will develop a new 3GB LPDDR3 solution based on four 6Gb LPDDR3 DRAM chips by symmetrically stacking two chips on each side, which will boost smartphone performance to the next level by year-end,” said Young-Hyun Jun, executive vice president, memory sales and marketing at Samsung Electronics.
With the increased mobile DRAM capacity, users can enjoy seamless high-quality, Full HD video playback and faster multitasking on their smartphones. Also, the new LPDDR3 speeds up data downloading and is able to offer full support for 4G/LTE-A (LTE Advanced) service, a next-generation mobile telecommunication standard.
Considering that the current memory storage capacity for PCs is about 4GB, offering 3GB of DRAM memory on mobile devices should help most users enjoy PC-like performance, in narrowing the performance gap between PC and smartphone computing.
With the new 3GB LPDDR3 DRAM, Samsung is now offering the widest range of mobile DRAM densities (1GB, 2GB and 3GB), while providing the industry’s first mobile DRAM based on 20nm class process node technology. Samsung plans to continue to lead the growth of the mobile memory market, as it seeks to maintain unrivaled competitiveness in the premium memory sector.