by Anton Shilov
10/30/2013 | 11:57 PM
SK Hynix said Wednesday that it had developed 6Gb LPDDR3 (Low Power DDR3) memory chip that is made using its 20nm class process technology. This product is a high-performance mobile memory solution that features low power consumption and high-density, which is aimed at next generation premium mobile devices.
The 6Gb memory chip works at 1866MHz, and with a 32-bit I/O it processes up to 7.4GB of data per second in a single channel, and 14.8GB in a dual channel. It can be provided in a form of ‘PoP’(package-on-package) to mobile devices. Four 6Gb LPDDR3 products can be stacked up and realize a high density of maximum 3GB (24Gb) solution in a single package. This package reduces the operating power as well as the standby current by 30% and the height of the package becomes thin compared to the company’s 4Gb-based one. In addition, it works at ultra low-voltage of 1.2V thus it satisfies low power consumption which mobile applications demand.
“After SK Hynix developed the world’s first high-density 8Gb LPDDR3 last June of this year, this is another achievement so that the Company can offer 6Gb LPDDR3 using 20nm class this time and is able to far strengthen its competitiveness in high-density products for mobile gadgets. Especially, with the 3GB solution based on 6Gb LPDDR3 which is optimal for high-end mobile devices, we will continuously lead the mobile industry” said Richard Chin, senior vice president and the head of global sales marketing.
3GB LPDDR3 products are expected to be noticeably loaded mainly on to high-end mobile devices from the first half of next year and will be loaded constantly until 2015. SK Hynix plans to diversify the product portfolio by enhancing its technology in the mobile products and developing top-performance memory products to actively lead the evolving mobile industry.
Samples of this new product have been already shipped to customers and the company plans to start the mass production at the beginning of next year.