News
 

Bookmark and Share

(0) 

Intel Corporation today introduced the Intel PRO/Wireless 2200BG network connection, enabling both 802.11b and rapid 802.11g wireless networking capabilities for notebook PCs based on Intel Centrino mobile technology.

The Intel PRO/Wireless 2200BG network connection is a standards-based and Wi-Fi CERTIFIED wireless local area network solution that allows up to 54Mb/s speed when operating in appropriate 802.11g networks. It is designed to maintain high throughput at longer ranges in office or home environments, along with efficient use of power to enable longer system battery life. The Intel PRO/Wireless 2200BG network connection is also software upgradeable, allowing it to support future security and other service enhancements.

The Intel PRO/Wireless 2200BG network connection consists of a communications and radio chip, both designed and developed by Intel at its wireless networking facilities in Haifa, Israel and San Diego, USA.

The Intel PRO/Wireless 2200BG network connection will be featured in Intel Centrino mobile technology-based notebook PCs that will be introduced worldwide throughout the first quarter of this year. In Japan, Fujitsu, Matsushita Electric Industrial, NEC, Sony and Toshiba are expected to announce new notebook PCs based on Intel Centrino mobile technology with the Intel PRO/Wireless 2200BG network connection in the coming weeks.

In 10 000-unit quantities, the Intel PRO/Wireless 2200BG network connection is priced at $25.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Thursday, May 16, 2013

11:41 pm | Dell Admits Windows 8 Did Not Meet Expectations, Pins Hopes on “Blue” Updates. Dell Disappointed with Windows 8, But Believes in the Future

10:59 pm | AMD Needs More Than Game Console Design Wins to Offset PC Market Declines – Analysts. AMD Has to Develop Competitive Product Lineup to Survive in Current Environment

10:33 pm | Corning Introduces Corning Lotus XT Glass for High-Performance Displays. Corning Advances Glass Substrate for High-Performance Displays

9:51 pm | True Stereo-3D Will Require 330MP – 3.3GP Resolutions, Says Developer of 8K Video Format. NHK: 8K Is the Final 2D Format, All Future Formats Will Be in 3D

9:41 pm | Innodisk Begins to Ship DDR4 RDIMM Samples to Server Makers. Independent DIMM Supplier Samples DDR4 RDIMMs

8:56 pm | Samsung Develops 45nm Embedded Flash Logic Process Technology. Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

7:57 pm | NHK Shows World’s First 8K Movie at Cannes Film Festival. Japanese National Broadcasting Company Demos 8K Movie, Content to Film Industry

7:27 pm | Intel’s Paul Otellini: Lack of Chip for iPhone, iPad Was My Worst Mistake. Intel’s Outgoing CEO Regrets About Mission Opportunities with Apple iOS