News
 

Bookmark and Share

(2) 

While Intel’s next-generation mobile processor code-named Dothan is expected to be pin-to-pin compatible with existing platforms for Intel Pentium M microprocessors, notebook makers are worried about increased thermal design power of the chip, as their chassis were developed taking into account only Intel’s current chip formerly known as Banias.

Intel Pentium M processor – the key-element of Intel Centrino mobile platform – is based on a micro-architecture specially tweaked for mobile applications that delivers high performance amid low power consumption to enable longer battery life in today’s systems. General micro-architecture of the Pentium M more resembles that of the Pentium III rather than the inner design of the Pentium 4. Nevertheless, the processor has some important advantages over the previous generation P6 architecture, such as support for SSE and SSE2, Advanced Branch Prediction, Micro-Op Fusion, Power Optimised Processor Bus, Dedicated Stack Manager technology as well as Enhanced Intel SpeedStep technology.

Currently Intel supplies flavors of Pentium M chips with 400MHz PSB, 1MB of L2 cache and speed-bins ranging from 900MHz to 1.70GHz. The microprocessors are manufactured using the company’s 0.13 micron process technology and have power dissipation from 12W to 24.5W.

Intel Pentium M “Dothan” processor will be made using Intel’s 90nm fabrication technology known for some issues with power leakage and higher than initially expected thermal dissipation and consumption. The code-named Dothan chip with 2MB L2, which initial core-clock is expected to achieve 1.80GHz, will at some point have higher power consumption compared to the Banias, sources among notebook makers said. As a result of such higher thermal envelope laptop manufacturers have to redesign at least some of their chassis to gain compatibility with the new CPU.

Next year Intel is expected to bring dual-core processor for mobile applications code-name Jonah. The chip is projected to contain two Dothan cores and dissipate 45W or more.

Officials for Intel Corporation did not comment on the report.

Discussion

Comments currently: 2
Discussion started: 03/30/04 05:37:28 AM
Latest comment: 04/02/04 12:10:10 AM

Add your Comment




Related news

Latest News

Friday, May 24, 2013

6:09 pm | Second-Generation Kinect Sensor for Windows Due in 2014 – Microsoft. Microsoft Discloses Additional Details About Kinect 2

4:24 pm | New Technique May Open Up an Era of Atomic-Scale Semiconductor Devices. Atom-Scale Semiconductor Devices May Be Incoming, Thanks to New Researchers

Thursday, May 23, 2013

11:30 pm | Kinect Support Is Not Mandatory for Xbox One Video Games – Microsoft. Microsoft Will Not Require Compulsory Support of Kinect from Xbox One Games

11:20 pm | Thermaltake Publishes List of PSUs Compatible with Intel Cori i “Haswell” Chips. 20 PSUs from Thermaltake Are Compatible with Next-Gen Intel Chips

11:10 pm | European Amazon Stores Start to List Xbox One with €599 Price-Tag. Microsoft Xbox One May Cost €599 in Europe, If First Listings Are Correct

9:28 pm | Apple to Assemble Macs in Texas, Set to Manufacture Parts Across the U.S. Apple’s Plan to Move Production Back to U.S. Gets Shape

9:12 pm | Microsoft Confident in Lack of Quality Issues with Xbox One Hardware. Microsoft Vows Xbox One Will Not Have RROD-Like Issues

8:52 pm | AMD Officially Launches New-Generation APUs for Mobile Applications [UPDATED]. AMD Introduces Kabini, Temash and Richland Accelerated Processing Units

6:51 pm | OCZ Reveals Vertex 450 Solid-State Drives: High-End Performance at Mainstream Prices. OCZ Introduces New SSDs Based on Indilinx Barefoot 3 Controller

3:40 pm | Nvidia Unveils GeForce GTX 780: GK110-Based Consumer Solution for $649. Nvidia’s Cut Down Titan LE Becomes GeForce GTX 780