News
 

Bookmark and Share

(2) 

While Intel’s next-generation mobile processor code-named Dothan is expected to be pin-to-pin compatible with existing platforms for Intel Pentium M microprocessors, notebook makers are worried about increased thermal design power of the chip, as their chassis were developed taking into account only Intel’s current chip formerly known as Banias.

Intel Pentium M processor – the key-element of Intel Centrino mobile platform – is based on a micro-architecture specially tweaked for mobile applications that delivers high performance amid low power consumption to enable longer battery life in today’s systems. General micro-architecture of the Pentium M more resembles that of the Pentium III rather than the inner design of the Pentium 4. Nevertheless, the processor has some important advantages over the previous generation P6 architecture, such as support for SSE and SSE2, Advanced Branch Prediction, Micro-Op Fusion, Power Optimised Processor Bus, Dedicated Stack Manager technology as well as Enhanced Intel SpeedStep technology.

Currently Intel supplies flavors of Pentium M chips with 400MHz PSB, 1MB of L2 cache and speed-bins ranging from 900MHz to 1.70GHz. The microprocessors are manufactured using the company’s 0.13 micron process technology and have power dissipation from 12W to 24.5W.

Intel Pentium M “Dothan” processor will be made using Intel’s 90nm fabrication technology known for some issues with power leakage and higher than initially expected thermal dissipation and consumption. The code-named Dothan chip with 2MB L2, which initial core-clock is expected to achieve 1.80GHz, will at some point have higher power consumption compared to the Banias, sources among notebook makers said. As a result of such higher thermal envelope laptop manufacturers have to redesign at least some of their chassis to gain compatibility with the new CPU.

Next year Intel is expected to bring dual-core processor for mobile applications code-name Jonah. The chip is projected to contain two Dothan cores and dissipate 45W or more.

Officials for Intel Corporation did not comment on the report.

Discussion

Comments currently: 2
Discussion started: 03/30/04 05:37:28 AM
Latest comment: 04/02/04 12:10:10 AM

Add your Comment




Related news

Latest News

Monday, April 14, 2014

8:23 am | Microsoft Vows to Release Xbox 360 Emulator for Xbox One. Microsoft Xbox One May Gain Compatibility with Xbox 360 Games

Tuesday, April 1, 2014

10:39 am | Microsoft Reveals Kinect for Windows v2 Hardware. Launch of New Kinect for Windows Approaches

Tuesday, March 25, 2014

1:57 pm | Facebook to Acquire Virtual Reality Pioneer, Oculus VR. Facebook Considers Virtual Reality as Next-Gen Social Platform

1:35 pm | Intel Acquires Maker of Wearable Computing Devices. Basis Science Becomes Fully-Owned Subsidiary of Intel

Monday, March 24, 2014

10:53 pm | Global UHD TV Shipments Total 1.6 Million Units in 2013 – Analysts. China Ahead of the Whole World with 4K TV Adoption

10:40 pm | Crytek to Adopt AMD Mantle Mantle API for CryEngine. Leading Game Developer Adopts AMD Mantle

9:08 pm | Microsoft Unleashes DirectX 12: One API for PCs, Mobile Gadgets and Xbox One. Microsoft Promises Increased Performance, New Features with DirectX 12

3:33 pm | PowerVR Wizard: Imagination Reveals World’s First Ray-Tracing GPU IP for Mobile Devices. Imagination Technologies Brings Ray-Tracing, Hybrid Rendering Modes to Smartphones and Tablets

2:00 pm | Nokia Now Expects to Close Deal with Microsoft in Q2. Sale of Nokia’s Division to Close Next Month