Bookmark and Share


ATI Technologies unveiled Wednesday its new visual processing units that brings unprecedented performance to thin-and-light notebooks – the MOBILITY RADEON X700. Numerous notebook makers adopted the novelty immediately.

ATI MOBILITY RADEON X700 is based on the RADEON X800 architecture, but is made using 0.11 micron process technology and, unlike desktop RADEON X800 partsl, feature 128-bit memory bus. The new mobile visual processing unit sports 8 pixel and 6 vertex pipelines and operates at 350MHz. The MOBILITY RADEON X700 is intended for notebooks with PCI Express x16 interconnection and will be available in various form-factors, including MCM, AXIOM and, if a customer demands, in NVIDIA-developed MXM form-factor.

The latest performance-mainstream mobile chips from ATI Technologies naturally support all the capabilities found in the RADEON X700 and RADEON X800 visual processing units for desktops, such as Shade Model 2.0b, 3Dc and other. Besides, the newcomer sports ATI’s HYPERMEMORY technology that allows VPU to use system memory as a buffer for graphics data.

ATI remained tight-lipped over thermal envelope of the MOBILITY RADEON X700, but said the chip features POWERPLAY technology designed to reduce power consumption. Additionally, 0.11 micron process technology and relatively low 350MHz/700MHz clock-speeds for core/memory are likely to allow the MOBILITY RADEON X700 to easily fit into very thin and light notebooks featuring Intel's recently unveiled Sonoma platform.

ATI MOBILITY RADEON X700 technology will be adopted by many of the industry’s top OEM and ODM designers including Acer, Arima, Asus, Alienware, BenQ, Clevo, Compal, ECS, Eurocom, Fujitsu, Fujitsu-Siemens, Gateway Inc, Inventec, Lenovo, LG, Medion, MSI, Samsung, Sony, Targa, Toshiba and Uniwill .


Comments currently: 0

Add your Comment

Related news

Latest News

Monday, July 21, 2014

12:56 pm | Microsoft to Fire 18,000 Employees to Boost Efficiency. Microsoft to Perform Massive Job Cut Ever Following Acquisition of Nokia

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014