News
 

Bookmark and Share

(0) 

Intel Corp. on Sunday updated its pricelist with minor changes in pricing of mobile microprocessors and Intel Centrino bundles. While the adjustments are insignificant, some large computer makers may benefit even from a several dollar price slash.

The decrease of pricing is not significant – Intel Centrino bundles that consist of an Intel Pentium M processor, an Intel mobile core-logic and an Intel PRO/Wireless WLAN controller dropped $2, or in the range of 0.28% - 0.74%. Intel reduced the costs for Intel Centrino sets with processor that use 533MHz processor system bus as well as on some of Low Voltage (LV) and Ultra Low Voltage (ULV) Intel Centrino bundles.

For instance, a package with Intel Pentium M 770 (2.13GHz), Intel 915 GM chipset and Intel PRO/Wireless 2915ABG controller now costs $703, down from $705. The most noteworthy price change was made to ULV Intel Celeron M processor 373 (1.0GHz): the chip now costs $144, down 10.56% from $161.

All of the processors with reduced pricing are made using Intel’s 90nm process technology.

The indicated prices are for direct Intel customers in 1000-unit tray quantities and, unless specified, represent the latest technology versions of the products. Prices may vary for different package types and shipment quantities, and special promotional arrangements may apply, the company notes on its web-sites.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Friday, May 17, 2013

11:57 pm | 4K Ultra-High Definition TVs Set to Become New Standard – Report. 4K Ultra-High Definition TVs Set to Become New Standard – Report

11:50 pm | Sales of Nintendo Wii U Hit Another Low in the U.S. Nintendo Wii U Just Cannot Become Popular

Thursday, May 16, 2013

11:41 pm | Dell Admits Windows 8 Did Not Meet Expectations, Pins Hopes on “Blue” Updates. Dell Disappointed with Windows 8, But Believes in the Future

10:59 pm | AMD Needs More Than Game Console Design Wins to Offset PC Market Declines – Analysts. AMD Has to Develop Competitive Product Lineup to Survive in Current Environment

10:33 pm | Corning Introduces Corning Lotus XT Glass for High-Performance Displays. Corning Advances Glass Substrate for High-Performance Displays

9:51 pm | True Stereo-3D Will Require 330MP – 3.3GP Resolutions, Says Developer of 8K Video Format. NHK: 8K Is the Final 2D Format, All Future Formats Will Be in 3D

9:41 pm | Innodisk Begins to Ship DDR4 RDIMM Samples to Server Makers. Independent DIMM Supplier Samples DDR4 RDIMMs

8:56 pm | Samsung Develops 45nm Embedded Flash Logic Process Technology. Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

7:57 pm | NHK Shows World’s First 8K Movie at Cannes Film Festival. Japanese National Broadcasting Company Demos 8K Movie, Content to Film Industry

7:27 pm | Intel’s Paul Otellini: Lack of Chip for iPhone, iPad Was My Worst Mistake. Intel’s Outgoing CEO Regrets About Mission Opportunities with Apple iOS