News
 

Bookmark and Share

(0) 

Intel Corp. recently began to list its forthcoming mobile Core Solo and Core Duo chips code-named Yonah in its processor spec finder database. The listing confirms that the company is about to formally unveil the world’s first dual-core mobile processors during the Consumer Electronics Show (CES) in Las Vegas, Nevada in early January, 2006.

At press time official specifications could not be retrieved.

Intel Core processors – which will be available in single-core and dual-core flavours – represent a yet another derivative of the so-called Banias architecture, which inherits many peculiarities of the P6 architecture. The Core Duo will have two processing engines and will be produced using 65nm process technology late this year with commercial availability scheduled for Q1 2006. The target clock-rate for Core processors is 2.17GHz, while the chip’s processor system bus will clock at 667MHz.

Intel at IDF Spring 2005 in the USA disclosed three new technologies planned for Core that will improve the performance, power and design of mobile platforms. They include Intel Digital Media Boost, an instruction set for rich digital multimedia content creation; Intel Advanced Thermal Manager, for enhanced thermal monitoring, accuracy and responsiveness; and Intel Dynamic Power Coordination, which can automatically adjust the performance and power between the two processing cores on demand.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Thursday, November 6, 2014

6:48 am | LG’s Unique Ultra-Wide Curved 34” Display Finally Hits the Market. LG 34UC97 Available in the U.S. and the U.K.

Wednesday, October 8, 2014

8:52 pm | Lisa Su Appointed as New CEO of Advanced Micro Devices. Rory Read Steps Down, Lisa Su Becomes New CEO of AMD

Thursday, August 28, 2014

12:22 pm | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

9:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

6:41 pm | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture